Test Development Services

For over 10 years, STATS ChipPAC’s Test Development Center has provided customers with world class test development and test program migration services.

Test Development Center

Located in Singapore, the Test Development Center (TDC) is comprised of English-speaking senior and staff level test engineers who provide test development services to STATS ChipPAC customers. TDC offers test development services for both Wafer Test and Final Test. TDC engineers have proven experience in developing test programs, probe cards, load boards and other interfacing solutions for RF, mixed signal, digital, memory and integrated system-on-chip (SOC) devices. They provide comprehensive development solutions for many different test platforms. Over the years, TDC has proven its capabilities to STATS ChipPAC customers who have shown their appreciation by involving TDC very early in the product development cycle and including them in on-site development meetings with the customer’s engineers.

TDC engineers work closely with resident test engineers at each STATS ChipPAC factory to ensure that TDC test program transfers into production are smooth and easy with fast production ramps to high volume production. The resident test engineers at each factory are also capable of delivering test development solutions in their areas of specialty (Centers of Excellence) with support from TDC in Singapore.

TDC engineers also work closely with the Test R&D group in Singapore to implement innovations in test technology that can be applied to all STATS ChipPAC factories. More on Tester Platforms available at STATS ChipPAC.